|
Type of pattern
|
Equipment
|
Resolution
|
Main applications
|
|
spatial
|
angular
|
|
Spot pattern
|
TEM
("SAD" = selected area diffraction)
|
0.5 - 1.5 μm
|
5° (1°)
|
thin foil
specimens
dark-field imaging
dislocations (weak beam)
Burgers vector analysis
precipitates, nanomaterials
orientation relationships
(estimate of) crystal orientation
|
|
Transmission
Kikuchi pattern
(TKP)
|
TEM
(SAD)
|
0.5 - 1.5 μm
|
0.2°
|
thick foil
specimens
medium size grains
crystal orientations
orientation differences
dislocation density
|
|
TEM, STEM
("MBD" = microbeam diffraction)
|
< 10 nm
|
0.2°
|
thick foil
specimens
fine grain structures
crystal orientations, ACOM
orientation differences
indexing of grain boundaries
deformed materials
grain growth
|
|
Backscatter
Kikuchi pattern
(BKP, "EBSP")
|
SEM
with a BKD/EBSD appliance
(low light level camera, computer control)
several commercial ACOM ("EBSD") systems available
|
< 30 nm
(FE gun)
0.05 - 1 μm
(W filament)
|
< 0.5°
|
bulk
specimens
coarse grains, mesostructure
crystal orientations, ACOM
dynamic experiments
(e.g. hot stage, tensile stage)
fracture surfaces
(residual stress)
phase identification (Phase ID)
|
|
Channeling
pattern
(ECP)
|
SEM
(as an option for some SEM commercially available)
|
10 - 50 μm
(SAD)
|
0.5°
|
bulk
samples
semiconductors (gentle method)
crystal orientation
orientation differences
residual stress
fracture
|
|
TEM pole-figure measurement
|
TEM
with a side-entry goniometer,
high-resolution camera or computer control
|
1 μm
(SAD)
0.1 mm (RHEED)
|
|
thin film
specimens (SAD)
bulk surfaces, layers (RHEED)
very fine grain structures
high degree of deformation
shear bands
texture fields
|
|
Convergent
Beam Electron Diffraction (CBED)
(Zone axis pattern;
Kossel-Möllenstedt pattern)
|
TEM
with cooling stage,
energy filter
|
5 nm
|
0.01°
|
inadequate for texture analysis.
determination
of lattice constants
residual stress
phase identification
space groups
structure potentials
|
|
X-ray
diffraction
X-ray scanning apparatus
|
Euler
cradle, x-y stage
and ED detector
an ED detector
and ED (or PS) detector
|
0.1 mm
50 μm
50 μm
0.1 mm
|
|
local pole
figures
texture mapping
element mapping (micro XRFA)
lattice strain mapping
|
R.A.
Schwarzer: Advances in the analysis of texture and microstructure.
Archives of Metallurgy and Materials 50 (2005) 7-20